Together, we’re shaping the future.

As a SMART USA Institute member, you are part of a best-in-class community driving the future of semiconductor manufacturing. We’re here to connect you—consistently and meaningfully—to:

  • The most innovative research, commercialization efforts, and breakthroughs
  • Fellow members and thought leaders across the value chain
  • The pulse of what’s next in digital transformation

Use the interactive diagram below to find out how SMART USA members are reflected in these critical competency areas.

demo9
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demo9
Workforce Development
  • Amatrol International
  • Auburn Univ.
  • Boise State Univ.
  • Canon Nanotechnologies
  • CEEK AI
  • Clemson Univ.
  • COG Auto
  • Cornell Univ.
  • Cornell Univ.
  • Dartmouth Col.
  • Dassault Systemes
  • FutureFit AI
  • IBM
  • Illinois Inst. of Tech.
  • Intel
  • Iowa State Univ.
  • MACNY
  • MediaTek
  • Micron
  • Morgan State Univ.
  • National GEM Consortium
  • Nat'l. Assoc. Comm. Col. Entrepreneurship
  • New Jersey Inst. of Tech.
  • New York Univ.
  • NIST
  • Pasadena City Col.
  • Pedegree Studios
  • Per Scholas
  • Purdue Univ.
  • Qualcomm
  • QuantumBloom
  • Razdan Research Inst.
  • Sandia Nat'l. Lab
  • SimInsights Inc
  • Smart Automation Certification Alliance
  • Southern Methodist Univ.
  • State Univ. New York at Albany
  • State Univ. New York at Binghamton
  • State Univ. New York at Binghamton
  • TalentCraft
  • Texas A&M Univ.
  • Texas Instruments
  • Training All People
  • Univ. of Florida
  • Univ. of Houston
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Oklahoma
  • Univ. of Southern California
  • Univ. of Texas at Austin
  • Univ. of Texas at Dallas
  • Univ. of Vermont
  • Virginia Tech Univ.
  • XR 2 Lead
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Analog and Mixed Signal Semiconductors
  • Analog Devices
  • Atomic Data Sciences
  • CircuitMind
  • Dartmouth Col.
  • Dassault Systemes
  • Florida International Univ.
  • IBM
  • Illinois Inst. of Tech.
  • Integral & Open Systems
  • Intel
  • Iowa State Univ.
  • MediaTek
  • Morgan State Univ.
  • New Jersey Inst. of Tech.
  • New York Univ.
  • North Carolina State Univ.
  • Purdue Univ.
  • Qualcomm
  • Sandia Nat'l. Lab
  • Texas A&M Univ.
  • Texas Instruments
  • Univ. of Florida
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Texas at Austin
  • Univ. of Vermont
demo9
Application Drivers and System Requirements
  • Analog Devices
  • CEEK AI
  • COG Auto
  • Dassault Systemes
  • Ephemeral Devices
  • Evolution Advisors
  • FabuBlox
  • Florida International Univ.
  • Georgia Tech Research Corp.
  • IBM
  • Infologic
  • Integral & Open Systems
  • Intel
  • Iowa State Univ.
  • MediaTek
  • NVIDIA
  • Purdue Univ.
  • Qualcomm
  • Razdan Research Inst.
  • Rensselaer Polytechnic Inst.
  • Sandia Nat'l. Lab
  • State Univ. New York at Binghamton
  • Texas Instruments
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Texas of Dallas
  • Univ. of Vermont
  • Zuru Automation
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Sustainability and Energy Efficiency
  • Analog Devices
  • Boise State Univ.
  • Canon Nanotechnologies
  • CEEK AI
  • COG Auto
  • Cornell Univ.
  • Dartmouth Col.
  • Dassault Systemes
  • EMD Electronics
  • Florida International Univ.
  • Georgia Tech Research Corp.
  • IBM
  • Illinois Inst. of Tech.
  • Infologic
  • Integral & Open Systems
  • Intel
  • Iowa State Univ.
  • MediaTek
  • New Jersey Inst. of Tech.
  • New York Univ.
  • North Carolina State Univ.
  • PoroDynamics
  • Purdue Univ.
  • Qualcomm
  • Razdan Research Inst.
  • Rensselaer Polytechnic Inst.
  • Sandia Nat'l. Lab
  • State Univ. New York at Binghamton
  • Texas Instruments
  • Univ. of Houston
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Maryland, Baltimore County
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Oklahoma
  • Univ. of Texas at Austin
  • Univ. of Vermont
  • Univ. of Virginia
  • Virginia Tech Univ.
demo9
Security and Privacy
  • Analog Devices
  • Athinia Technologies
  • Auburn Univ.
  • Boise State Univ.
  • Clemson Univ.
  • COG Auto
  • Dassault Systemes
  • Data Pulse
  • Ephemeral Devices
  • Florida International Univ.
  • GoSecure
  • IBM
  • Illinois Inst. of Tech.
  • Integral & Open Systems
  • Intel
  • Iowa State Univ.
  • MediaTek
  • New York Univ.
  • Practical Fusion
  • ProSentra
  • Purdue Univ.
  • Qualcomm
  • Rensselaer Polytechnic Inst.
  • Sandia Nat'l. Lab
  • Smart Automation Certification Alliance
  • Southern Methodist Univ.
  • State Univ. New York at Binghamton
  • Texas A&M Univ.
  • Univ. of Florida
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Maryland, Baltimore County
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Texas at Austin
  • Virginia Tech Univ.
demo9
Digital Processing
  • Analog Devices
  • Athinia Technologies
  • Atomic Data Sciences
  • Boise State Univ.
  • CircuitMind
  • Cornell Univ.
  • Dartmouth Col.
  • Dassault Systemes
  • Data Pulse
  • EMD Electronics
  • Ephemeral Devices
  • Florida International Univ.
  • Forge Nano
  • IBM
  • Illinois Inst. of Tech.
  • Infologic
  • Integral & Open Systems
  • Intel
  • Iowa State Univ.
  • MediaTek
  • New Jersey Inst. of Tech.
  • North Carolina State Univ.
  • Purdue Univ.
  • Qualcomm
  • Razdan Research Inst.
  • Rensselaer Polytechnic Inst.
  • Sandia Nat'l. Lab
  • Savansys
  • Silvaco Inc.
  • Southern Methodist Univ.
  • State Univ. New York at Albany
  • State Univ. New York at Binghamton
  • Texas A&M Univ.
  • Univ. of Florida
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Oklahoma
  • Univ. of Texas at Austin
  • Univ. of Texas at Dallas
  • Univ. of Vermont
  • Zuru Automation
demo9
Analog and Mixed-Signal Microelectronics
  • Analog Devices
  • Atomic Data Sciences
  • CircuitMind
  • Dartmouth Col.
  • Dassault Systemes
  • Florida International Univ.
  • IBM
  • Illinois Inst. of Tech.
  • Integral & Open Systems
  • Intel
  • Iowa State Univ.
  • MediaTek
  • Morgan State Univ.
  • New Jersey Inst. of Tech.
  • New York Univ.
  • North Carolina State Univ.
  • Purdue Univ.
  • Qualcomm
  • Sandia Nat'l. Lab
  • Synclesis
  • Texas A&M Univ.
  • Texas Instruments
  • Univ. of Florida
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Southern California
  • Univ. of Texas at Austin
  • Univ. of Vermont
demo9
Photonics and MEMS
  • Analog Devices
  • Atomic Data Sciences
  • Boise State Univ.
  • CircuitMind
  • Dartmouth Col.
  • Dassault Systemes
  • Georgia Tech Research Corp.
  • IBM
  • Integral & Open Systems
  • Intel
  • Iowa State Univ.
  • MediaTek
  • Morgan State Univ.
  • New Jersey Inst. of Tech.
  • New York Univ.
  • Purdue Univ.
  • Qualcomm
  • Sandia Nat'l. Lab
  • SEMI
  • Texas A&M Univ.
  • Texas Instruments
  • Univ. of Florida
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Minnesota
  • Univ. of Southern California
  • Univ. of Texas at Austin
  • Univ. of Virginia
demo9
Advanced Packaging and Heterogeneous Integration
  • ASE
  • Atomic Data Sciences
  • Canon Nanotechnologies
  • COG Auto
  • Dassault Systemes
  • Georgia Tech Research Corp.
  • IBM
  • Idaho National Lab
  • Integral & Open Systems
  • Intel
  • Iowa State Univ.
  • MediaTek
  • Micron
  • Morgan State Univ.
  • Purdue Univ.
  • Qualcomm
  • Sandia Nat'l. Lab
  • SEMI
  • SK hynix
  • State Univ. New York at Binghamton
  • Synclesis
  • Texas A&M Univ.
  • Univ. of Florida
  • Univ. of Houston
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Texas at Austin
  • Univ. of Texas at Dallas
  • Univ. of Vermont
  • Univ. of Virginia
  • Yield Engineering Systems
demo9
Materials, Substrates, and Supply Chain
  • ASE
  • Athinia Technologies
  • Atomic Data Sciences
  • Auburn Univ.
  • Boise State Univ.
  • Canon Nanotechnologies
  • CircuitMind
  • Clemson Univ.
  • Cornell Univ.
  • Dartmouth Col.
  • Dassault Systemes
  • EMD Electronics
  • Florida International Univ.
  • Forge Nano Inc
  • Georgia Tech Research Corp.
  • IBM
  • Illinois Inst. of Tech.
  • Integral & Open Systems
  • Intel
  • MediaTek
  • Micron
  • Morgan State Univ.
  • New Jersey Inst. of Tech.
  • New York Univ.
  • ProDex Labs
  • Purdue Univ.
  • Qualcomm
  • Rensselaer Polytechnic Inst.
  • Sandia Nat'l. Lab
  • SK hynix
  • State Univ. New York at Binghamton
  • Texas A&M Univ.
  • Texas Instruments
  • Univ. of Florida
  • Univ. of Houston
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Notre Dame
  • Univ. of Southern California
  • Univ. of Texas at Austin
  • Univ. of Vermont
  • Univ. of Virginia
  • Virginia Tech Univ.
  • Zuru Automation
demo9
Design, Modeling, Test, and Standards
  • AccuStrata
  • Analog Devices
  • Atomic Data Sciences
  • Auburn Univ.
  • Boise State Univ.
  • Canon Nanotechnologies
  • CEEK AI
  • Clemson Univ.
  • COG Auto
  • Cornell Univ.
  • Dartmouth Col.
  • Dassault Systemes
  • Data Pulse
  • FabuBlox
  • Florida International Univ.
  • Georgia Tech Research Corp.
  • IBM
  • Illinois Inst. of Tech.
  • Integral & Open Systems
  • Iowa State Univ.
  • MediaTek
  • New Jersey Inst. of Tech.
  • New York Univ.
  • ProDex Labs
  • Purdue Univ.
  • Qualcomm
  • Razdan Research Inst.
  • Rensselaer Polytechnic Inst.
  • Sandia Nat'l. Lab
  • Savansys
  • SEMI
  • Silvaco Inc.
  • Southern Methodist Univ.
  • State Univ. New York at Binghamton
  • Synclesis
  • Univ. Minnesota
  • Univ. of Florida
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Maryland, Baltimore County
  • Univ. of Southern California
  • Univ. of Texas at Austin
  • Univ. of Vermont
  • Vinci4D
  • Virginia Tech Univ.
  • XR 2 Lead
  • Yield Engineering Systems
demo9
Manufacturing and Process Development Metrology
  • AI Nano Systems Inc
  • Analog Devices
  • ASE
  • Athinia Technologies
  • Atomic Data Sciences
  • Auburn Univ.
  • Canon Nanotechnologies
  • CEEK AI
  • CircuitMind
  • Clemson Univ.
  • Dartmouth Col.
  • Dassault Systemes
  • Data Pulse
  • EMD Electronics
  • FabuBlox
  • IBM
  • Illinois Inst. of Tech.
  • Infologic
  • Integral & Open Systems
  • MediaTek
  • Micron
  • New Jersey Inst. of Tech.
  • Practical Fusion
  • ProDex Labs
  • Purdue Univ.
  • Sandia Nat'l. Lab
  • Savansys
  • SEMI
  • Silvaco Inc.
  • State Univ. New York at Albany
  • State Univ. New York at Binghamton
  • Texas A&M Univ.
  • Texas Instruments
  • Univ. of Houston
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Oklahoma
  • Univ. of Southern California
  • Univ. of Texas at Austin
  • Univ. of Vermont
  • Univ. of Virginia
  • Virginia Tech Univ.
demo9
Digital Twins and Applications
  • AccuStrata
  • Analog Devices
  • Atomic Data Sciences
  • Boise State Univ.
  • Canon Nanotechnologies
  • CEEK AI
  • CircuitMind
  • COG Auto
  • Dartmouth Col.
  • Dassault Systemes
  • Evolution Advisors
  • FabuBlox
  • FutureFit AI
  • Georgia Tech Research Corp.
  • IBM
  • Idaho National Lab
  • Illinois Inst. of Tech.
  • Integral & Open Systems
  • Iowa State Univ.
  • MediaTek
  • Micron
  • Multiscale Technologies
  • New York Univ.
  • NVIDIA
  • Per Scholas
  • PoroDynamics
  • Practical Fusion
  • ProDex Labs
  • Purdue Univ.
  • Qualcomm
  • Razdan Research Inst.
  • Sandia Nat'l. Lab
  • SEMI
  • Smart Automation Certification Alliance
  • State Univ. New York at Albany
  • State Univ. New York at Binghamton
  • Synclesis
  • Texas A&M Univ.
  • Training All People
  • Univ. of Florida
  • Univ. of Illinois
  • Univ. of Illinois Urbana-Champaign
  • Univ. of Minnesota
  • Univ. of Notre Dame
  • Univ. of Southern California
  • Univ. of Texas at Austin
  • Univ. of Vermont
  • Vinci4D
  • XR 2 Lead
  • Yield Engineering Systems
  • Zuru Automation