SMART USA is launching a funding initiative to address critical gaps in semiconductor manufacturing by advancing scalable digital twin technologies. The program targets innovations that enhance semiconductor design, manufacturing, packaging, assembly, and testing. It also aims to strengthen U.S. competitiveness, reduce production costs, improve yields, and build a skilled workforce.

Solicitation Topics

  • Using Digital Twins to Optimize Core Semiconductor Manufacturing Processes
  • Digital Twins for Advanced Packaging and System Technology Co-Optimization
  • Digital Twin Validation Across Semiconductor and/or Packaging Technologies
  • Democratizing Access to Community Colleges and other Workforce and Community Programs (Education and Workforce Development)
  • Establishing a Library of New and Pre-Existing Content and Educational Training Programs (Education and Workforce Development)

Upcoming Office Hours

Commercial Viability & Domestic Production (CVDP) Guidance

Have proposal questions about CVDP? We’re here to help project teams drive towards the commercial implementation of your project innovations.

Join these group Office Hours to learn more and get your questions answered.

  • Thursday, July 17 @ 3:30-4:30 PM Eastern

  • Wednesday, July 30 @ 3:30-4:30 PM Eastern

During one of the times listed above, click this button to

Solicitation Forms &  Documents


* You must register for a website account on www.src.org in order to submit.

NOTE

You must be a member to submit to this funding solicitation. Learn more about joining SMART USA here.

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